Abstract
Unbalanced magnetron sputtering has made remarkable progress in the field of hard coatings during the last few years. Various arrangements of magnet and cathode have been reported recently. The new ABSTM physical vapour deposition coater HTC 1000-4 combines the methods of steered arc and unbalanced magnetron technology. It also uses an optimized four-cathode set-up with a combination of permanent magnets and electromagnets. This approach allows high ionization throughout the vacuum chamber and uses high productivity substrate fixtures which up till ow have been used only in ion-plating systems with evaporation sources. The average bias current density in the new coater is approximately 4 mA cm−2 if operated under standard deposition parameters for TIN.
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