Abstract
A grounded lamination gate (GLG) structure for high-kappa gate-dielectric MOSFETs is proposed, with grounded metal plates in the spacer oxide region. Two-dimensional device simulations performed on the new structure demonstrate a significant improvement with respect to the threshold voltage roll-off with increasing gate-dielectric constant (due to parasitic internal fringe capacitance), keeping the equivalent oxide thickness same. A simple fabrication procedure for the GLG MOSFET is also presented
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