A New Graduate Educational Program in Electronic Packaging and Reliability (EPAR)

Abstract

AbstractA new specialization, at the graduate level, in Electronic Packaging and Reliability (EPAR) at the University of Maryland is described. This program was initiated to meet the growing industrial need for interdisciplinary expertise in the area of electronic packaging. Currently, a framework of appropriate coursework, examinations, and research projects leading to M.S. and Ph.D. degrees is in place. In order to meet the coursework requirements for these degrees, new introductory and specialized courses have been developed at three levels. The first level core courses serve as the entry points into the graduate program. More focused courses are offered at the second and third levels. Students in the EPAR program are generally required to take half of the academic credits from these courses and the other half as traditional engineering core courses in mechanics, vibrations, reliability, thermal engineering, and computer aided design. In order to respond effectively to the evolving nature of the field, the EPAR courses are kept current by strong industrial participation. Many of the specialized graduate courses include guest lectures by industrial experts. In addition to the full semester graduate courses, a number of shorter educational modules have also been developed for use in a just‐in‐time fashion in existing traditional courses and curricula. Currently, approximately twenty students are enrolled in the EPAR program.