Abstract
A new failure analysis technique based on the thermo-electromotive force induced by laser irradiation has been developed for evaluation of interconnects. This technique, which uses a high sensitivity OBIC (optical beam induced current) system, realizes the sensitive detection of defects, such as infant and advanced defects in aluminium (Al) interconnects, with no application of voltage or the removal of overlaid insulator films. This technique has been demonstrated in the analyses of many modes of interconnect failure.
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