Abstract

Formation of abrupt tunneling junction for the sub-nanometer tunnel FET (TFET) is crucial for achieving better electrical behavior. This task is more challenging in the case of dopingless TFETs (DL TFETs). In this concern, we propose a novel design of DL TFET, wherein a metallic layer has been placed in the oxide region at the space present between gate and source electrode (used for inducing p+ region) of conventional dopingless n-TFET to overcome the issue of low on-state current ( $\text{I}_{\mathrm{on}}$ ) due to presence of tunneling barrier. Proposed modification is helpful for achieving steeper tunneling junction at the source/channel interface, which enables higher tunneling generation rate of charge carriers at this interface. The optimization for work function of the metal layer (ML) has been performed for improving $\text {I}_{\mathrm{on}}$ , point subthreshold swing and threshold voltage ( $\text {V}_{\text {th}}$ ). Finally, the impact of the ML misalignment from the gate/source terminal and optimization of its length is also presented.

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