A New Coupled Thermal Stress FE-Model for Investigating the Influence of Non-Isothermal Conditions on Bond Strength and Bonding Status of the First Pass in Roll Bonding

Abstract

Roll bonding is a joining-by-forming process to permanently join two or more layers of different materials by hot or cold rolling. One of the typical industrial applications is aluminium sheets for heat exchangers in automobiles. During roll bonding the layers are fed into the rolling stand with parallel surfaces. Due to the plastic deformation in the roll gap metallic bonds between the layers are achieved. Several theoretical models have been published to describe the process, e.g. Zhang & Bay. These models have mostly been developed for cold rolling and describe the bond strength based on surface enlargement, contact pressure and flow stress. Since these models are developed for cold rolling, they are not temperature depending. Heat exchange is usually neglected and de-bonding after the roll gap is not accounted for. However, for hot roll bonding the above mentioned assumptions do not hold true. To understand the mechanisms of hot roll bonding industrial and laboratory scale investigations have previously been conducted. Based on the findings a FE framework for hot roll bonding was developed. This FE framework accounts for the possibility of de-bonding after the roll gap but is restricted to isothermal conditions. However, for a roll bonding simulation it is essential to take the temperature influence into consideration. Therefore, this paper presents an extended version of the FE framework which accounts for temperature dependent material flow, compatible definition of thermal & mechanical interactions and bonding status related heat exchange. To verify the new features of the extended FE framework a roll bonding test case is employed. Mechanical and thermal interactions as well as the current flow stress are calculated in subroutines in order to enable a fully coupled thermal stress simulation. The results show that with this extended FE framework the influence of non-isothermal conditions on material flow and bonding status as well as the feedback effects of bonding status to heat exchange have been successfully integrated in hot roll bonding simulations. This fully coupled thermal stress simulation is the first step towards multi-pass roll bonding simulations.