Abstract
We deposited secondary explosive and multilayer thermite films directly onto semiconductor bridges (SCBs) and other substrates. Methods for the deposition of two thermite films (aluminum/copper oxide and magnesium/fluorocarbon polymer) were developed as part of this study and a new capability was obtained for depositing adherent films on any material, including Teflon and Gore-Tex. Our experimental program determined conditions for the SCB ignition of the deposited films, and with the aluminum/copper oxide film, we observed a lower threshold for ignition of a powder pressed against the bridge. We also looked at other ignition methods including lasers, spark discharges, primers and hot combustion gases.
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