A New BCB Film Zero-Level Packaging for RF Devices

Abstract

This paper presents a whole benzocyclobutene (BCB) film encapsulated 0-level packaging using a wafer level BCB bonding technique. Wafer-scale membrane transfer technique using silicon carrier wafers was used to make BCB membrane caps for encapsulation placed above the device wafers. The RF characteristics using coplanar waveguide (CPW) lines were measured to evaluate the effect of BCB film package. The insertion loss change of CPW lines by BCB membrane package is below 0.01 dB up to 90 GHz, while the glass packaged CPW lines show about 0.1 dB deviation from 20 GHz to 110 GHz