Abstract
This paper presents a whole benzocyclobutene (BCB) film encapsulated 0-level packaging using a wafer level BCB bonding technique. Wafer-scale membrane transfer technique using silicon carrier wafers was used to make BCB membrane caps for encapsulation placed above the device wafers. The RF characteristics using coplanar waveguide (CPW) lines were measured to evaluate the effect of BCB film package. The insertion loss change of CPW lines by BCB membrane package is below 0.01 dB up to 90 GHz, while the glass packaged CPW lines show about 0.1 dB deviation from 20 GHz to 110 GHz
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
