Abstract
3D integration of heterogeneous modules including RF and millimeter-wave (mmW) functionalities is opening new challenges for packaging developers to conciliate between electrical performance, thermal behavior and mechanical reliability using cost-effective technologies. This paper deals with innovative integrated antenna solutions within the particular context of 3D heterogeneous integration on silicon interposer using a disruptive design approach. Novel integration schemes of antennas using a high-impedance surface (HIS) reflector are presented. Then, the design steps of a 60-GHz folded dipole antenna for short-range communications are detailed. Simulation and measurement results show promising performances in terms of gain and radiation efficiency. Process and fabrication issues are addressed with specific Back-End processing developments and an experimental validation is proposed.
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