Abstract
Abstract The reliability of electronic assemblies is a vital criterion used to assure product quality over its lifetime. Weibull distribution is the most common distribution utilized to describe the reliability data. Most of the studies use the Weibull scale parameter, or characteristic life, to compare alternatives and make a selective decision. This may not lead to achieving the optimal parameters which can be problematic because this method doesn’t consider the variability behavior of the fatigue life. In this study, a new approach for process parameters selection is proposed to find the optimal parameter values that improve the micro-optimality selection process based on reliability data. In this study, a new approach is proposed based on examining the solder joint reliability by using a multi criteria analysis. The fuzzy logic is utilized as a tool to solve the multi criteria problem that is presented from the proposed approach. The reliability of microelectronic connections in thermal cycling operating conditions is used as a validation case study. In the validation case study, the optimal process parameters are found for ball grid array electronic components. Two levels of the solder sphere materials, three levels of the surface finish, and 10 levels of solder paste alloys are studied as process parameters. Using the proposed approach, four quality responses are employed to assess the reliability data, including the scale parameter, the B10 (life at 10% of the population failure), mean-standard deviation response, and the signal to noise ratio (SNR). The fuzzy logic is applied to solve the multiresponse problem. An optimal process parameter setting that considers different quality characteristics was found for the validation case study. ENIG surface finish, SAC305 solder sphere, and material six were the optimal factor levels that are obtained for the aged CABGA208 component using the proposed approach.
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