Abstract
In this work, we applied two electromagnetic models for the characterization of a planar structure including a flat, thick copper conductor. Indeed the first model is consisted by modeling two metal ribbons without bulkiness, placed one above the other at a distance of h2 equal to the thickness of the thick conductor. This approach has been implemented and tested by the iterative method. The results of simulations have been compared with those calculated by the Ansoft HFSS software, and they are in good concordance, validating the method of analysis used. The second model is based on the calculation of the effective permittivity of the medium containing the thick conductor. This medium consists of a metallic region of complex relative permittivity , the rest of this medium is filled with air er2 = 1. The effective permittivity eeff calculated from these two relative permittivity er2 and . Comparing the simulation results of this new formulation of the iterative method with those calculated by the software Ansoft HFSS shows that they are in good matching which validates the second model.
Highlights
In Radio frequency, most devices are made in micro strip technology [1] [2]
We have shown the efficiency of the correction allocated to the iterative method by the two modals proposed for the modeling of the planar structures integrating the thick conductors
Simulations results found were compared with those calculated by the software Ansoft HFFS, they were in good agreement, validating the method of analysis used
Summary
In Radio frequency, most devices are made in micro strip technology [1] [2]. This technology became the best known and most used, this is due to its flat nature, ease of manufacturing, low cost, easy integration with circuits. A new formulation of the iterative method FWCIP (Fast Wave Concept Iterative Process) was made to extend the study of planar structures with thick flat conductor. This method is based on the concept of wave [9]. The electromagnetic behavior of a planar structure will be described by writing the boundary conditions and continuity of the tangential fields on each pixel containing the interface circuitry to study. This integral formulation retains the advantages well known iterative methods including ease of implementation and speed of execution
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