Abstract
A micro-scale thermosyphon heat pipe technology which passively utilizes 3D chip’s specific micro-channels structure as the evaporating section of the thermosyphon to form a thermosyphon boiling in micro-channels for 3D chip cooling is proposed. The maximum heat flux and heat transfer coefficient of thermosyphon boiling in micro-channels which simulated actual 3D chip structure were experimentally studied. Experiments were carried out using four kind of working liquids: two pure fluids (deionized water and R113), super-moist fluids (R113+surfactant) and nanofluids (R113+surfactant+CuO nanoparticles). The height and gap of channels used were in the range of 30mm to 100mm and 30μm to 1mm, respectively. Experimental results show that nanofluids can significantly enhance both the maximum heat flux and heat transfer coefficient of thermosyphon boiling in micro-channels due to super-wettability of the liquid and the formation of a porous sedimentary layer consisted of nanoparticles on the wall. The results show that the micro thermosyphon heat pipe structure is a promising technology for 3D chip cooling.
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