A Multivariable Numerical Investigation of Wavy-Based Microchannel Heat Sink Geometry Towards Optimal Thermal Performance

Abstract

Abstract This research provides a comprehensive multivariable comparative investigation of the effect of various microchannel configurations on their thermal performance. Three-dimensional fluid flow and heat transfer simulations are performed with different arrangements of the channel's width tapering and cross-sectional aspect ratio with an emphasis on the synergistic proven effects of geometrical parameters in innovatory combinations. Results confirm that wavy channels are significantly superior to straight channels in terms of thermal performance due to the creation of secondary flow (Dean Vortices), which improves the processes of advective mixing and, therefore, overall heat transfer characteristics with minimal pumping power penalty. Width-tapering of wavy channels also shows better thermal resistance than untapered wavy channels producing almost 10 percent thermal resistance improvement. The study indicates a significant dependency of thermal performance on the cross-sectional aspect ratio of the channel which suggests that there are ideal tapering and aspect ratio conditions. An innovative wavy-tapered microchannel heat sink has been introduced, featuring an optimal parametric configuration and directionally alternating coolant flow. This design results in additional thermal resistance improvement by 15% and significantly improves substrate temperature distribution uniformity. Overall, the results demonstrate the superior potential of the configuration for high-end electronics cooling tasks. These results provide interpretive insight into microchannel heat sink design and optimization.