Abstract

The objective of this study is to co-integrate multiple digital and analog functions together within CMOS by developing a universal magnetic tunneling junction stack (MTJ) capable of realizing logic, memory, and analog functions, within a single baseline technology. This will allow monolithic heterogeneous integration, fast and low-power processing, and high integration density, particularly useful for Internet of Things (IoT) platforms. This unique spintransfer-torque (STT) MTJ is called Multifunctional Standardized Stack (MSS). This paper presents the progress regarding memory, oscillator and sensor functionalities targeted for the technology. We show that a single magnetic stack deposition can be used to obtain these three functionalities on the same wafer.

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