A multidimensional scheme of characterization for performance deterioration behavior of flexible devices under bending deformation

Abstract

A concept of three dimensional visual characterization is proposed here for the performance deterioration behavior of flexible electronic devices under bending deformation. Here the loading space is defined in a two dimensional manner with two axes. One is to indicate the severity of bending, starting from completely flat ending with ultimately loaded where the device is folded into half. The other is to indicate the number of loading cycles with specified levels of bending severity. By plotting the performance, whatever it is, in a three dimensional manner over the plane spanned with these two axes, its deterioration behavior is fully visualized quantitatively and entirely over the possible space of bending load. Feasibility of such a characterization is eventually demonstrated with silver nano-particle printed flexible wires. The experimental results are examined in detail from the view point of finding useful information for reliability improvement, i.e. promising contribution of the concept for further development of more robust flexible devices.