Abstract
This paper describes the design, fabrication and performance of a 512-MEMS-mirror array module with a hermetically sealed package for large optical cross-connects. This configuration enables a ? 5? rotation of the two-axis stationary operation under a drive voltage of 160?V, with a high resonant frequency of 2?kHz. The 512-MEMS-mirror array module was constructed using newly developed multi-chip direct mounting (MCDM) technology, which allowed us to use small scale mirror array chips and greatly simplifies the fabrication process. The MCDM technology was demonstrated to be especially well suited to building large port count mirror array modules without the size limitation involved with handling wafers. The 512-MEMS-mirror array module measures a compact 122?mm ? 60?mm.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
