Abstract
• A dynamic, thermal dielectric crack model is proposed for piezoelectric materials. • Explicit expressions for the thermal, electric and elastic quantities are given. • The electric displacement inside the opening crack is determined. • Thermal stress intensity factor is presented for real or complex eigenvalues. • Influence of the crack moving velocity is shown. This article conducts an exact analysis of a thermal dielectric crack moving in piezoelectric materials. Self-generating thermal and electric loadings by the crack interior are exerted on the crack surfaces as well as various external loadings including a shearing force. Fundamental solutions of the thermal and electro-elastic coupling fields are given by determining a temperature function and a harmonic function with eigenvalues properties due to material properties considered. Analytical expressions are obtained benefiting evaluation of key parameters. Numerical analysis is done and some interesting observations are found. There is a critical crack velocity within and beyond which the electric loading exerts different influences on the thermal flux of crack interior and the thermal stress intensity factor.
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