Abstract
The soft deposition of copper clusters on the Au(001) surface is studied by constant temperature molecular dynamics simulations. The influence of the incident kinetic energy in the low-energy limit and of the temperature is analyzed. Deposition energies range from 1 to 100meV/atom. The equilibrium structure of deposited clusters has been investigated. Two methods of analysis have been used to analyze supported clusters. A method based on the alignment of pairs of opposite neighbours and the method known as the common neighbour analysis. Cluster behaves elastically keeping its aspect ratio at very low energies while at higher energies its shape changes and internal stresses induce an internal reorganization of the atoms. The lower the temperature the lower the energy at which grains start to be observed in the clusters.
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