Abstract
A large-scale molecular dynamics simulation was used to investigate the propagation of cracks in three dimensional samples of nanocrystalline copper, with average grain sizes ranging from 5.34 to 14.8 nm and temperatures ranging from 1K to 500 K. It was shown that intragranular fracture can proceed inside the grain at low temperature, and plastic deformation around the tip of the crack is accommodated by dislocation nucleation/emission; indeed, both fully extended dislocation and deformation twinning were visible around the tip of the crack during fracture. In addition, due to a higher concentration of stress in front of the crack at a relative lower temperature, it was found that twinning deformation is easier to nucleate from the tip of the crack. These results also showed that the decreasing grain size below a critical value exhibits a reverse Hall-Petch relationship due to the enhancing grain boundary mediation, and high temperature is better for propagating ductile cracks.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
