Abstract
Molecular dynamics method is employed to simulate the compression deformation of the polymer materials for electronic packaging. The effects of moisture content, conversion degree, strain rate and temperature on the mechanical properties of epoxy resin are investigated. The stress–strain curves, Young's modulus and Poisson ratio are compared with existing experimental data. The results show that mechanical properties of epoxy resin decrease obviously with increasing moisture content and temperature. However, the high cross-linking conversion and strain rate enhance the mechanical properties of resin.
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