Abstract
Accurate testing history data is necessary for all fatigue life prediction approaches, but such data is always deficient especially for the microelectronic devices. Additionally, the sequence of the individual load cycle plays an important role in physical fatigue damage. However, most of the existing models based on the linear damage accumulation rule ignore the sequence effects. This paper proposes a thermal fatigue life prediction model for ball grid array (BGA) packages to take into consideration the load sequence effects. For the purpose of improving the availability and accessibility of testing data, a new failure criterion is discussed and verified by simulation and experimentation. The consequences for the fatigue underlying sequence load conditions are shown.
Highlights
Solder joint interconnects serve as electrical connections and mechanical bonds between components and the substrate [1]
Some researchers believe that the variation of load conditions has an effect on the ball grid arrays (BGA) products failure time [4], study [5] indicates that the linear cumulative damage law cannot conform to the experiments well
It indicates the solder joints that are closer to the edge of package the larger plastic strain they will suffer, which coincides with the experiment results in [24]
Summary
Solder joint interconnects serve as electrical connections and mechanical bonds between components and the substrate [1]. Some researchers believe that the variation of load conditions has an effect on the BGA products failure time [4], study [5] indicates that the linear cumulative damage law cannot conform to the experiments well. They focus on the sequence influence of individual cycles in physical fatigue damage accumulation. This paper tries to propose a life prediction model for BGA packages that takes load sequence influence into consideration that is considered more appropriate for application. The extent of solder joint resistance variation and crack expansion as an alternative failure criteria for measuring the physical fatigue damage
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