Abstract
ABSTRACTA simple, practical model is developed for cw laser recrystallization of silicon and SOI structures, taking into account spatial variations in optical reflectivity. The power absorption is assumed to be uniform within each of three regions: the central molten spot, the annular two-phase region, and an outer annulus to account for absorption in the solid phase. Analytic expressions are obtained for the radial and depth dependence of the temperature, for the melt depth, the melt radius, the melt threshold, the crystallization threshold and the substrate melt threshold. SOI structures are considered and comparison with some experimental results shows excellent agreement.
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