Abstract
An analytical model is developed for predicting electroplated copper thickness distributions on multilayer printed wiring boards. Plated copper thickness distributions are predicted within a plated‐through hole (PTH) by coupled solutions of the potential, kinetics, and mass diffusion equations. The model establishes: (a) correlation parameters including geometric, charge transfer, mass transfer, and ohmic solution effects, and (b) the minimum electrolyte convection required in a PTH to avoid rough or powdery deposits. Predictions are compared with experimental data obtained over a wide range of operating scales from breakers to full‐scale production tanks.
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