Abstract
A damage model and simulation strategy are developed to simulate fatigue damage evolution and predict fatigue life of metallic films. The fatigue damage model is established based on the collective effect of current all micro/nanoscale cracks within material in a homogenized way, and block cycle jump method is used in the simulation strategy, which can speed up fatigue damage evolution simulation for metallic films reasonably. Based on numerical study, fatigue damage evolution and life of the smooth and notched specimens for copper films subjected to various stress levels are numerically analyzed and compared with the corresponding experimental results. It shows that the developed damage model and simulation strategy can be used to simulate the fatigue damage evolution and predict fatigue life for metallic films reasonably.
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