Abstract
A new metal patterning process, called micropatterned metal embedding (MME), that enables micropatterned metal lines to be embedded into polymer substrates for flexible circuit interconnections is introduced and experimentally demonstrated. Aluminum/PMMA double layers that are patterned onto a silicon substrate are directly transferred to the PMMA substrate using a hot embossing process. Thus, the patterned aluminum lines are encapsulated in the PMMA and fully embedded in the PMMA substrate. The pattern transfer can be accomplished as a result of the relatively lower bonding energy at the silicon/PMMA interface compared with that of an aluminum/PMMA interface. An aluminum-embedded PMMA sheet with an area of 45 × 50 mm2 was fabricated to evaluate its applicability. After the bending test of the fabricated prototype, no cracks in the aluminum lines were observed.
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