Abstract
Solid‐solution Al‐Ta alloys possess significantly higher pitting potentials than pure aluminum in Cl− solutions. Dynamic imaging microellipsometry was used to study the passive film formation on solid solution Al‐Ta alloys. Film thickness was measured during growth for alloy compositions of pure Al Al‐8 a/o Ta Al‐25 a/o Ta, and pure Ta at applied potentials of 0.0, 1.0, 2.0, and 5.0 V SCE in a pH 7.2 borate buffer. Increasing the concentration of tantalum resulted in the formation of thinner passive films at all applied potentials. On pure Al and Al‐8 a/o Ta, precipitation of an type film results in a linearly increasing film thickness with time. The relationship of film thickness measurements to the enhanced localized corrosion resistance is discussed.
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