Abstract
Numerical modeling of electronic assemblies under impact loading is a major interesting problem. Due to the complexity of the analysis, simulation time is usually expensive. Therefore, the current paper aims to present a methodology that uses static analysis to effectively simulate the impact-stimulated mechanical response of electronic packages using finite element analysis (FEA). First, the mathematical basis of the equivalent static loading to replace shock loading are thoroughly discussed. The findings of this analytically derived solution are accordingly validated with the results of experimentally measured data and with dynamic FEA simulations. Additionally, a computational efficiency study was conducted to prove the effectiveness of the equivalent static methodology. Finally, the study results showed high accuracy of this proposed equivalent static approach with 85 % reduction in analysis time and 70 % in computer resources usage. Therefore, the present paper highly recommends the equivalent static analysis methodology as it allows for computationally effective and very accurate numerical simulations.
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