Abstract

The application of established test routines like power cycling to wide bandgap devices may be not as straightforward as it seems: When power cycling silicon carbide MOSFETs, the original purpose of triggering package related degradations under application-like and accelerated conditions might be influenced by device related changes during the test, such as carrier trapping, which may lead to a shift in the threshold-voltage V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</sub> and, thus, in the operating point. With the aim to track the V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</sub> shift during power cycling in order to separate the mechanisms-i.e., to indicate and quantify the different overlapping effects-a novel inline ΔV <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</sub> measurement approach is proposed, which can be integrated in existing power cycling test benches with only minor adaptions. First power cycling results with ΔV <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</sub> monitoring reveal a shift in the operating point leading to an early failure detection in conjunction with a V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</sub> shift.

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