Abstract
An electronic method for the measurement of thickness and deposition rate of conducting films during a vacuum evaporation is described. Operational amplifiers are employed to monitor the change in resistance of a deposited layer and their outputs used to servo control the deposition rate and automatically cut off the vapour stream when the deposit has reached a predetermined thickness. The equipment allows close control of the deposition rate and thickness, thereby increasing the uniformity of deposited layers during successive evaporations.
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