Abstract
Microwave circuits and modules are widely used in communication, navigation, detection and other fields. Under the requirement of increasingly miniaturization, integration, high frequency and high reliability of microwave modules, the change of interconnection configuration of circuit modules in microwave modules will have a significant impact on the signal transmission performance. The interconnection configuration of core wire is modeled by parameterized characterization, and the correlation mechanism between interconnection configuration and electrical performance is studied, so as to determine the optimal interconnection configuration parameters for electrical performance transmission, which can significantly improve the interconnection signal transmission performance and guarantee the working quality of highperformance electronic equipment.
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