A memory supplier's outlook on die products

Abstract

Mobile PCs and servers, wireless handsets, personal appliances and other mobile applications are driving the need for high-performance, low-cost, small form factor memory solutions. For this reason, die products as well as integrated packaging technologies are increasingly more prevalent as memory solutions designed into these applications. System designs are increasingly implementing integrated packaging strategies, such as the multichip package (MCP) or stacked package and system in package (SiP) products. The growth in die product demand is reflected in semiconductor manufacturers development of new production and test processes to enable the production of die products with a higher yield. The applications integrating die products are diverse, each one with its own form factor and device characteristic requirements. The emergence of several new packaging and die product solutions offers designers options and the ability to pick the technology that best meets their design requirements. The wafer level chip scale package (WLCSP) is an example of an emerging packaging technology. WLCSP with a redistribution layer (RDL) applied provides many advantages over the standard thin small outline package (TSOP) and ball grid array (BGA) packages including electrical, thermal, and mechanical properties.