Abstract
Our in situ experiments of polyimide-supported thin indium tin oxide (ITO) films reveal buckling-driven film cracking in some samples and buckling-driven interfacial delamination in other samples. Although studies of individual buckling-driven failure mode exist, it still remains unclear what governs the competition between these two different failure modes in a given film/substrate structure. Through theoretical analysis and numerical simulations, we delineate a map of competing buckling-driven failure modes of substrate-supported thin brittle films in the parameter space of interfacial adhesion and interfacial imperfection size. Such a map can offer insight on the mechanical durability of functional thin films. For example, interestingly, we show that strongly bonded thin brittle films are more prone to buckling-driven cracking, a more detrimental failure mode for thin brittle ITO transparent conductors widely used in displays and flexible electronics.
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