A Low-Cost Antenna-in-Package Solution for 77GHz Automotive Radar Applications

Abstract

This work proposes a low-cost Antenna in package (AiP) solution implemented on Advanced single sided substrates (aS3 package) for 77-GHz automotive radar applications. The impact of fabrication tolerances is also studied in this work. This work demonstrates firstly the 77-GHz losses of the transition from chip to package among flip-chip ball grid array (FCBGA) package, flip chip chip scale (FCCSP) package, Fan out wafer level chip scale package (Fan-out WLP), and aS3 package. Although Fan-out WLP can minimizes 77-GHz losses of transition from chip to package plus package to PCB, low-cost AiP solutions are very important for 77-GHz automotive radar applications. The proposed AiP solution on aS3 package has low losses of transition from chip to package, and the performance of designed antenna on aS3 package meets the requirements of 77-GHz automotive radar systems. Finally, this work also demonstrates the impact of fabrication inaccuracies on the bandwidth and radiation pattern of AiP on aS3 package. This work provides a cost-effective AiP approach for 77-GHz automotive radar systems.