Abstract
Low-temperature, fast curing latent catalysts for epoxides were prepared by microencapsulation of aluminum complexes through interfacial and radical polymerization. The resulting resin microcapsules were thermally responsive. Moreover, because the inside of the capsule had a porous structure, a highly active aluminum complex could be forced into the capsule by solvent penetration. The differential scanning calorimetric curve of the encapsulated complex showed an exothermic peak at 100°C or less. In addition, after a mixture of bisphenol A epoxy resin, the curing catalyst, and triphenyl silanol was stored for 5000h at 30°C, the viscosity was only 1.6 times greater than the viscosity just after blending.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
