Abstract
A new low-temperature biochemically compatible polymer bonding process has been successfully developed. The bonding has been characterized for bond strength and chemical resistance. This technique has successfully addressed a major challenge in the development of microfluidic systems from discrete components by enabling the bonding of the components to the microfluidic motherboards at low temperatures and ensuring reliable, leak-proof and chemically inert bonding. This bonding technique uses a spin-on Teflon-like amorphous fluorocarbon polymer. The bonding technique lowers the bonding temperature (∼160 °C), shows a good bond strength of 4.3 MPa in silicon-to-silicon, and has excellent chemical resistance to various chemicals used in microelectromechanical systems processing.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
