Abstract
A novel silicon-on-insulator (SOI) trench metal-oxide-semiconductor field effect transistor (MOSFET) with a reduced specific on-resistance (Ron,sp) is presented. It features an oxide-filled trench and a non-depleted embedded p-type island (p-SOI). The oxide trench folds the drift region into a U-shape, resulting in a reduction in cell pitch and Ron,sp. The non-depleted p-island is employed to further reduce Ron,sp by increasing the optimized doping concentration of the drift region without deteriorating the breakdown voltage (BV). The simulation results show that the p-SOI decreases the Ron,sp to 10.2mΩ·cm2 from 17.4mΩ·cm2 of the conventional SOI MOSFET at the same BV.
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