Abstract

A linear series-fed patch array (SFPA) antenna is designed based on a low cost Fan-Out Panel Level Packaging technology. The presented antenna operates from 60GHz to 64GHz and is targeted for millimeter-wave radar application. The antenna achieves more than 10dBi radiation gain with good return loss in the entire operating bandwidth. The antenna is investigated to be less sensitive to the thickness variation of the air gap caused by the solder balls. The antenna-inpackage (AiP) is a promising solution to produce a low cost high performance system-in-package (SiP) module for MMW radar system.

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