Abstract
The localized radial basis function (RBF) meshless approach is well suited for modeling transient heat conduction. The advantages of meshless methods, such as ease of discretization, are well known. However, there are still few examples of the method extended to three-dimensional (3D) transient heat conduction for geometries of practical engineering importance; in particular, with respect to graphics processing units (GPUs). In this study, we investigated the localized RBF meshless method in 3D transient heat conduction and explored its application for GPUs. Numerical examples are provided with an application to modeling chip cooling and friction welding.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
