Abstract
A linear array thin film position sensitive detector (LTFPSD) based on hydrogenated amorphous silicon (a-Si:H) is proposed for the first time. Taking advantage of the optical properties presented by a-Si:H devices, we have developed a LTFPSD with 128 integrated elements able to be used in 3D inspections/measurements. Each element consists of a one-dimensional LTFPSD, based on a p-i-n diode produced in a conventional PECVD system, where the doped layers are coated with thin resistive layers to establish the required device equipotentials. By proper incorporation of the LTFPSD into an optical inspection camera it will be possible to acquire information about an object/surface, through the optical cross-section method. The main advantages of this system, when compared with the conventional CCDs, are the low complexity of hardware and software used and that the information can be continuously processed (analog detection).
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