Abstract
A process to slice and separate GaN device layers for vertical light emitting diodes (LEDs) is presented through a developed electrochemical anodization process to create nanoporous (NP) GaN of designed porosity profiles. The NP GaN serves dual purposes of supporting subsequent overgrowth of LED structures while undergoing, during growth, shape transformation into a largely voided morphology. It is shown that this voided region decreases the lateral fracture resistance and enables large-area separation of the LED structures after appropriate wafer bonding. The separated LED layers are shown to have comparable material quality before and after the liftoff process. Blue emitting GaN LEDs are transferred to silicon substrates with vertical configuration by this unique process.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
