Abstract
Plated through hole (PTH) plays a critical role in printed circuit board (PCB) reliability. Thermal fatigue deformation of the PTH material is regarded as the primary factor affecting the lifetime of electrical devices. Numerous research efforts have focused on the failure mechanism model of PTH. However, most of the existing models were based on the one-dimensional structure hypothesis without taking the multilayered structure and external pad into consideration. In this paper, the constitutive relation of multilayered PTH is developed to establish the stress equation, and finite element analysis (FEA) is performed to locate the maximum stress and simulate the influence of the material properties. Finally, thermal cycle tests are conducted to verify the accuracy of the life prediction results. This model could be used in fatigue failure portable diagnosis and for life prediction of multilayered PCB.
Highlights
With the miniaturization of printed circuit board scale and the increase in package density, electronic interconnection malfunctions occur more frequently
The primary reason of Plated through hole (PTH) failure is the difference between the CTE of the substrate and plating material, which generates a cyclic tension-compression force inside the plating layer under thermal loads according to the constitutive relation, produces thermal fatigue deformation, and leads to the PTH and even the whole electrical device failure
This paper proposes an improved model to reveal the constitutive relationship of every point on the PTH in multilayered printed circuit board (PCB) by combining mechanical equations under the boundary conditions with finite element simulation of the PTH weakness
Summary
With the miniaturization of printed circuit board scale and the increase in package density, electronic interconnection malfunctions occur more frequently. Reference [3] gave a stress-strain analytical equation in the elastic-plastic range, and proposed two major experimental measurements of structural failure mechanisms. This model did not satisfy the free boundary condition of plating surface and the continuous displacement rule between plating wall and substrate bonding. Materials 2017, 10, 382 pad structure as beam structure and assumed that axial strain and stress in the board thickness direction were consistent They analyzed the effect of different parameters on PTH reliability during the thermal cycle. The random coefficient regression method reference [19] is adopted to revise our prediction model by taking the uncertainty of test samples caused by material or processing factors into consideration
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