Abstract
Copper/steel bimetal, one of the most popular and typical multi-material components (MMC), processes excellent comprehensive properties with the high strength of steel and the high thermal conductivity of copper alloy. Additive manufacturing (AM) technology is characterized by layer-wise fabrication, and thus is especially suitable for fabricating MMC. However, considering both the great difference in thermophysical properties between copper and steel and the layer-based fabrication character of the AM process, the optimal processing parameters will vary throughout the deposition process. In this paper, we propose an analytical calculation model to predict the layer-dependent processing parameters when fabricating the 07Cr15Ni5 steel on the CuCr substrate at the fixed layer thickness (0.3 mm) and hatching space (0.3 mm). Specifically, the changes in effective thermal conductivity and specific heat capacity with the layer number, as well as the absorption rate and catchment efficiency with the processing parameters are considered. The parameter maps predicted by the model have good agreement with the experimental results. The proposed analytical model provides new guidance to determine the processing windows for novel multi-material components, especially for the multi-materials whose physical properties are significantly different.
Highlights
Accepted: 10 November 2021Multi-material components (MMC), such as gradient materials, dissimilar joints, and sandwich structure materials, are characterized by spatial composition variation in one or more directions [1]
We propose an analytical calculation model to predict the layer-dependent processing parameters during the fabrication of copper/steel bimetal
If the copper/steel bimetal is treated as a number andsteel, δ t is and the layer single component, the theoretical effective thermal conductivity [34], density, and δ specific heat capacity of the multi-material components (MMC) are obtained in Equations (15)–(17) [41,42]
Summary
Multi-material components (MMC), such as gradient materials, dissimilar joints, and sandwich structure materials, are characterized by spatial composition variation in one or more directions [1]. Due to their unique properties with progressive change in performance and function, MMC has gained notable attention and has been widely used in many fields such as electrical and aerospace over the past few decades [2]. Because effective thermal conductivity varies between layers, the processing parameters may need to change as the deposition layer numbers increase This phenomenon is prominent for copper/steel dissimilar materials, because the thermophysical properties, such as thermal conductivity, of copper and steel differ greatly.
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
