Abstract
A hybrid method was developed in this study for fatigue life prediction (FLP) of lead-free solder (LFS) joints in ball grid array package under the coupled electrical–thermal–mechanical (ETM) fields. A modified constitutive model for lead-free solder joints under coupled ETM fields was proposed to describe the mechanical and fatigue behavior of solder joints under coupled ETM fields. A modified damage model under coupled ETM fields was then developed to obtain the fatigue life of LFS joints under coupled ETM fields. Uniaxial tension tests of an Sn–3.0Ag–0.5Cu (SAC305) solders and coupled multifields fatigue experiments were performed to verify the accuracy, applicability and validity by the modified constitutive model and fatigue damage model under coupled ETM fields. Based on the modified constitutive model and fatigue damage model, a hybrid method, including current, temperature and mechanics parameters, was proposed for the FLP of the LFS joints, which was demonstrated to be able to predict the results well. A hybrid method provides an idea for investigating the fatigue life of lead-free solder joints in coupled fields.
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