Abstract
A honeycomb porous microchannel cooling system for electronics cooling was proposed in this article. The design, fabrication, and test system configuration of the microchannel heat sink were summarized. Preliminary experimental investigation was conducted to understand the characteristics of heat transfer and cooling performance under steady single-phase flow. In the experiments, a brass microchannel heat sink was attached to a test heater with 8 cm2 area. The experimental results show that the cooling system is able to remove 18.2 W/cm2 of heat flux under 2.4 W pumping power, while the junction wall temperature is 48.3°C at the room temperature of 26°C. Extensive experiments in various operation conditions and parameters for the present cooling system were also conducted. The experimental results show that the present cooling system is able to perform heat dissipation well.
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