A high-precision optical fiber adaptive lithography method for vertical integration of optical fiber and planar chip

Abstract

The vertical heterogeneous integration structure of optical fibers and planar chips has taken on important functions in many MEMS devices and systems such as optical waveguide chips, MEMS vector hydrophones, and integrated optical fiber sensors. An optical fiber end face adaptive lithography method has been proposed in this paper to improve the alignment accuracy of fiber-to-chip integration. It uses the optical fiber to be integrated as the transmission medium for the UV exposure light source, and the optical fiber end face serves as a lithography pattern, thereby realizing highprecision pattern transfer of the optical fiber end face shape. We simulated the fiber optic adaptive exposure model using Zemax optical software, and analyzed the effect of light source power, exposure distance, and exposure angle on the experimental results. Finally, an adaptive fiber exposure experiment was performed, and the fiber end face shape and lithography pattern were compared and analyzed.