Abstract
This study presents a novel high-speed micro-impact testing system for evaluating the shear strength and energy absorbance properties of lead-free solder ball joints under impact velocities of 0.3–1.0 m/s. The test method can examine the failure mode transition from ductile failure to brittle failure based on the failure mode distribution percentage. The load—displacement curves can distinguish between different failure modes. Notably, the values of peak load and the energy-to-peak load at various impact speeds can be used as indices for determining solder ball under impact loading conditions. Thus, the proposed method is a suitable technique for evaluating the mechanical response of solder ball joints used in typical semiconductor packages and, therefore, represents a simple and effective technique for optimizing the chip-level reliability of portable consumer electronic products.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
