Abstract
This study presents a novel high-speed micro-impact testing system for evaluating the shear strength and energy absorbance properties of lead-free solder ball joints under impact velocities of 0.3–1.0 m/s. The test method can examine the failure mode transition from ductile failure to brittle failure based on the failure mode distribution percentage. The load—displacement curves can distinguish between different failure modes. Notably, the values of peak load and the energy-to-peak load at various impact speeds can be used as indices for determining solder ball under impact loading conditions. Thus, the proposed method is a suitable technique for evaluating the mechanical response of solder ball joints used in typical semiconductor packages and, therefore, represents a simple and effective technique for optimizing the chip-level reliability of portable consumer electronic products.
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