A High Reverse Breakdown Voltage p-GaN Gate HEMT with Field Control Drain

Abstract

In this work, a high reverse blocking voltage (BV R) p-GaN gate high electron mobility transistor with field control drain (FCD-HEMT) has been proposed and fabricated. The FCD-HEMT features the field control drain (FCD), consisting of electrically shorted Ohmic contact structure and p-GaN cap. In the OFF-state, the 2-Dimensional Electron Gas (2DEG) channel is cut off due to the p-GaN cap introduced field control, which provides FCD-HEMT with reverse blocking capability. In the ON-state, the re-formed 2DEG channel offers a non-potential barrier pathway for electrons transfer from source to drain and ensures a low resistance of the FCD-HEMT. The fabricated device exhibits 1400 V forward breakdown voltage (BV F) and −1240 V reverse breakdown voltage (BV R), 12.7 mΩ·cm2 low specific ON-resistance, and 188 mA mm−1 max drain current while maintaining normally-OFF capability. These results demonstrate the great potential of FCD-HEMTs in 1200 V-class power applications.