Abstract

Abstract Results of the first ultra-high-resolution studies of the low-temperature electrical resistivity of thin metal foils are reported. 10 and 25 μm thickness high-purity foils of Ag and Au, and a single 25 μm foil of Cu have been measured over the temperature range 1·2 to 8 K. In all the foils, surface scattering was the dominant resistive mechanism. For all three metals the temperature dependence of the resistivity in the foils appears to be almost the same as that of bulk material having the same residual resistivity. Thus there is no evidence of an additional temperature dependence arising solely from the presence of the surface.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.