Abstract
We have developed novel device architecture of comb-driven double-gimbal XY-stage of high fill-factor (stage area / chip size), which has been realized for the first time by topologically separating the actuator elements in two layers: all the electrical parts (electrodes and interconnections) are in the Silicon-on-Insulator (SOI) layer, while the mechanical parts (suspensions, frame, and XY-stage) are in the substrate. Thanks to the new layered structures, the overall footprint of the actuator has been made small. The XY-stage moved 19µm in the X and the Y direction independently, and also in the diagonal direction.
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