A Hierarchical Modeling Approach of Thermal Vias Using CNT-based Composites

Abstract

Thermal problems are one of the most crucial problems that must be addressed when designing electronic systems with high-density nano-scale structures. A promising approach is the enhancement of the thermal conductivity by using thermal vias with thermally high-conductive composites, such as polymers filled with carbon nanotubes (CNTs). The chapter presents a modeling approach that considers the complex behavior of CNTs in composites in order to predict the thermal system behavior. The approach is based on a hierarchical finite element analysis model of thermal via arrays. It comprises the levels CNT, composite base cube, thermal via and via array. By using the effective medium approach of a composite base cube, CNTs can be integrated into a macroscopic model despite their nanometer scale. Such an optimized model of thermal via arrays using CNT-based composites significantly simplifies thermal simulations of these nanoscale structures. Results achieved using the presented modeling approach allow an efficient comparision of various technological solutions prior to practical experiments.